Project Description

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Base Material:Aluminum /2W
Layer No:1 Layer
Copper Thickness: 1oz
Board Thickness:1.6mm
Min.Hole Size: 1.0mm
Solder Mask: White
Silkscreen:/
Suface Finishing:HASL
Testing way:ET
Tolerance of hole position:0.05MM
Standards:IPC Class 2, Class 3is text.